Document Type
Report
Abstract
We need more from our computers; faster speeds, more power, artificial intelligence, and 5G capability, but we want it cheaply. The use of chiplets allows for more customizations based on needs, more efficient power consumption, and integration into different Internet of Things (IoT) applications while simultaneously reducing electronic waste during the manufacturing process. The integration of chiplets into the chip manufacturing industry could meet the demand for high-performance computing while keeping the computer system’s data safe with encryption and authentication capabilities [11]. By running thermal response simulations of chiplets on heterogeneous substrates and in different integrated circuit formations, it can be determined which combination of variables would be best suited to meet the needs of the computer system and mitigate the risk of overheating. For purposes of this project, the substrate being analyzed is limited to organic substrates with different architectures of chiplets and silicon interposers.
Publication Date
12-1-2023
License
This work is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 4.0 International License.
Recommended Citation
Haghighi, Ashley, "Thermal Response of Chiplets With The Heterogeneous Integration of Materials" (2023). 2023 Fall Honors Capstone Projects. 5.
https://mavmatrix.uta.edu/honors_fall2023/5