Graduation Semester and Year
2015
Language
English
Document Type
Thesis
Degree Name
Master of Science in Mechanical Engineering
Department
Mechanical and Aerospace Engineering
First Advisor
Agonafer Dereje
Abstract
In power electronics, as there is continuous increase in performance of the electronic devices, simultaneously the size of the components used in these devices keep on decreasing. This has resulted in increased power densities and the requirements for excellent cooling as well in order to avoid the failure of those devices. Traditionally, while designing a cooling system for a device, uniform heat flux is assumed throughout the components. In many cases this method may not be accurate for a particular model design. There are chances that the heat flux distribution around the components are non-uniform and requires a more accurate device level modelling and analysis of the system. Since the technology is continuously improving with high power, high density electronics, it is necessary to understand the thermal stack up of the component system to avoid thermal failures. The work presented highlights the affect of device level modelling of a semi-conductor device used in power electronics. Detailed thermal analysis considering uniform flux and device level model have been performed on an Insulated Gate Bi-Polar Transistor [IGBT].
Keywords
CFD, Flow simulation, Power electronics, IGBT, Thermal analysis cold plate
Disciplines
Aerospace Engineering | Engineering | Mechanical Engineering
License
This work is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 4.0 International License.
Recommended Citation
Kadaba Nagaraja Urs, Abhishek Raj Urs, "PARAMETRIC STUDY OF AN IGBT COLD PLATE AND AFFECT OF DEVICE LEVEL MODELLING ON SYSTEM LEVEL THERMAL PREDICTIONS" (2015). Mechanical and Aerospace Engineering Theses. 946.
https://mavmatrix.uta.edu/mechaerospace_theses/946
Comments
Degree granted by The University of Texas at Arlington