Author

Koushik Epuri

Graduation Semester and Year

2016

Language

English

Document Type

Thesis

Degree Name

Master of Science in Mechanical Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Agonafer Dereje

Abstract

Air cooling is predominant cooling technique employed in most of the data centers. As the demand for High performance computing (HPC) which deploy large concentration of high-end servers (30 kW to 200 kW per rack) is increasing, it is becoming challenging to cool the systems using air cooling. Liquid cooling has significant advantages over air cooling techniques due to higher heat capacities of fluids. Liquid immersion cooling using dielectric and non-corrosive mineral oils is one of the potential alternative to air cooling methods for high density data centers. In this work, we consider a third generation open compute server optimized for air cooling and find optimal heat sinks for immersion cooling. It is possible to use low profile heatsinks due to the thermal mass of the liquid vs air and thus reduce the server profile and potentially increase the server density in a rack. CFD is used to design the optimal heatsink.

Keywords

Electronic packaging, Oil immersion cooling, Optimization, Heat sink, ANSYS Icepak

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

Comments

Degree granted by The University of Texas at Arlington

25829-2.zip (1009 kB)

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