Reliability of a 2.5D TSV package

Author

Neha Vinayak Gaikwad

Graduation Semester and Year

2018

Language

English

Document Type

Thesis

Degree Name

Master of Science in Mechanical Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Dereje Agonafer

Second Advisor

Ratan Kumar

Abstract

In the recent years, the Through Silicon Vias (TSVs) are helping a huge variety of the 3D IC and the 2.5D IC packaging applications to try to fulfill their requirements of functionality and higher connectivity at the expense of lower power consumption and minimum heat dissipation. The TSVs offer great interconnect density, high device density, short connection paths, great space efficiency and high interconnect bandwidth. The basic difference between a 3D TSV package and a 2.5D TSV package is that the 2.5D one interconnects the dies side by side on a silicon interposer, over its entire length. The interposer, placed between the package substrate and the dies consists of the TSVs that are the interconnections between the top and bottom layers, whereas the 3D one interconnects the dies one above the other, i.e. on the top of each other. In this, the TSVs are present in the die at the bottom, which is just above the package substrate. Apart from the various advantages of the TSVs, the challenges associated with them are higher utilization of the manufacturing area and thus they ultimately result in the position barriers by securing an entire layer. Also the metal degradation impact on them, their failure due to the environmental stresses induced in them and the overall impact of these on the entire package are also some of the challenges in TSVs, which question the reliability of the packages. In this research, a 2.5D TSV package was subjected to a thermal cycling test to investigate its reliability. For that, at first a detailed model of a 2.5D IC package is created and analyzed in ANSYS 18.0. But considering its huge number of elements and higher computational time, the compact modeling technique is implemented on it. The compact model is then subjected to thermal cycling and the output parameter thus obtained for it is compared and validated to that obtained for the detailed model.

Keywords

2.5D, TSV

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

License

This work is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 4.0 International License.

Comments

Degree granted by The University of Texas at Arlington

Recommended Citation

Gaikwad, Neha Vinayak, "Reliability of a 2.5D TSV package" (2018). Mechanical and Aerospace Engineering Theses. 805.
https://mavmatrix.uta.edu/mechaerospace_theses/805