Computational Analysis of Enhancing Heat Transfer in a 3-D stacked Die Using Different Finned Heat Sink

Author

Deekshith Pittala

Graduation Semester and Year

2015

Language

English

Document Type

Thesis

Degree Name

Master of Science in Mechanical Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Dereje Agonafer

Abstract

3D die stacking is an exciting new technology that increases the transistor’s density by integrating two or more dies vertically with a dense high – speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die and across dies in a system. The objective of the thermal design requirement for a 3D stacked die package is to maintain the junction temperatures of the devices at or below specified limits. Installing the Heat sink aid the heat transfer activity from a package. The extent of cooling and the junction temperatures vary if the designs of the heat sinks change. Therefore, this study is to discover a heat sink which gives the best result in the heat extraction process.

Keywords

Electronic packaging, 3D die stacking, Heat sink

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

License

This work is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 4.0 International License.

Comments

Degree granted by The University of Texas at Arlington

Recommended Citation

Pittala, Deekshith, "Computational Analysis of Enhancing Heat Transfer in a 3-D stacked Die Using Different Finned Heat Sink" (2015). Mechanical and Aerospace Engineering Theses. 795.
https://mavmatrix.uta.edu/mechaerospace_theses/795