Graduation Semester and Year
2020
Language
English
Document Type
Thesis
Degree Name
Master of Science in Aerospace Engineering
Department
Mechanical and Aerospace Engineering
First Advisor
Dereje Agonafer
Abstract
Electronic Packaging materials and their properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Glass transition temperature plays a vital role in the field of Electronic Packaging. It is the temperature range where the material changes from a rigid glassy material to a soft (not melted) material and is usually measured in terms of the stiffness or modulus. The commonly used component in today’s electronics world are PCBs and substrate which are an integral part of it. There are few known ways of finding out the Glass transition temperature. The thesis focuses on Dynamic Mechanical Analysis (DMA) and Thermo Mechanical Analysis (TMA) for measuring it. These techniques are considered more reliable. The study focuses on analyzing the results from both the devices and comparing them . Analyzing the readings from the graphs generated during the test gives a perspective of understanding the behavior of the material and its nature when it reaches to glass transition temperature and importance of it. It is found out that DMA results are more reliable in comparison with TMA.
Keywords
DMA, TMA, Glass transition temperature
Disciplines
Aerospace Engineering | Engineering | Mechanical Engineering
License
This work is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 4.0 International License.
Recommended Citation
Yadav, Shristi, "ANALYSIS OF GLASS TRANSITION TEMPERATURE OF PCB & SUBSTRATE USING DYNAMIC MECHANICAL ANALYSIS & THERMOMECHANICAL ANALYSIS" (2020). Mechanical and Aerospace Engineering Theses. 768.
https://mavmatrix.uta.edu/mechaerospace_theses/768
Comments
Degree granted by The University of Texas at Arlington