Graduation Semester and Year
Summer 2024
Language
English
Document Type
Thesis
Degree Name
Master of Science in Mechanical Engineering
Department
Mechanical and Aerospace Engineering
First Advisor
Dereje Agonafer
Second Advisor
Abdolhossein Haji-Sheikh
Third Advisor
Pardeep Shahi
Abstract
The transistor density of CPUs and GPUs has significantly grown due to the growing computational demands of general computing and artificial intelligence. This has resulted in comparatively greater heat fluxes from these components that necessitate cooling solutions with higher thermal dissipation power (TDP). As a result, conventional air cooling is no longer adequate. A proposed solution to the cooling problem is to use cutting-edge direct-to-chip (DTC) liquid cooling using a cold plate method which offers far greater TDP and can increase the energy efficiency of high-performance computing (HPC) systems. This research compares several Propylene Glycol (PG) based single-phase coolant liquids in DTC setups. These coolants contain additives that can inhibit bio growth and reduce corrosion, but at the possible expanse of thermal performance. Following ASHRAE guidelines, this work compares the thermal efficiency, wettability, and environmental impact of these different additives. The DTC setup utilized a single cold plate on a thermal test vehicle (TTV) that was instrumented with various temperature and pressure monitors. For each coolant, the flow rate and coolant temperature were varied for a wider dataset. A thorough evaluation of the thermal resistance (Rth) and pressure drop (∆P) versus coolant flowrate and inlet temperature was conducted to illustrate sensitivity to these parameters. The result of this evaluation shows how well these coolants perform in different conditions, helping us choose the best one. This work aids in addressing solutions to the significant heat fluxes from modern CPUs and GPUs and in advancing thermal management strategies in HPC systems.
Keywords
Data Center, Thermal Resistance, Pressure drop, Direct to Chip liquid cooling, Power Density
License
This work is licensed under a Creative Commons Attribution 4.0 International License.
Recommended Citation
Emami, Meysam, "Characterization of direct-to-chip Cold Plates using different Fluids at various parameters" (2024). Mechanical and Aerospace Engineering Theses. 671.
https://mavmatrix.uta.edu/mechaerospace_theses/671