ORCID Identifier(s)

0000-0001-6924-081X

Graduation Semester and Year

2015

Language

English

Document Type

Thesis

Degree Name

Master of Science in Mechanical Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Agonafer Dereje

Abstract

In power electronics, as there is continuous increase in performance of the electronic devices, simultaneously the size of the components used in these devices keep on decreasing. This has resulted in increased power densities and the requirements for excellent cooling as well in order to avoid the failure of those devices. Traditionally, while designing a cooling system for a device, uniform heat flux is assumed throughout the components. In many cases this method may not be accurate for a particular model design. There are chances that the heat flux distribution around the components are non-uniform and requires a more accurate device level modelling and analysis of the system. Since the technology is continuously improving with high power, high density electronics, it is necessary to understand the thermal stack up of the component system to avoid thermal failures. The work presented highlights the affect of device level modelling of a semi-conductor device used in power electronics. Detailed thermal analysis considering uniform flux and device level model have been performed on an Insulated Gate Bi-Polar Transistor [IGBT].

Keywords

CFD, Flow simulation, Power electronics, IGBT, Thermal analysis cold plate

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

Comments

Degree granted by The University of Texas at Arlington

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