ORCID Identifier(s)

0000-0002-5410-1734

Graduation Semester and Year

2018

Language

English

Document Type

Thesis

Degree Name

Master of Science in Mechanical Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Dereje Agonafer

Abstract

The adoption of immersion cooling of data center over conventional air-cooling is one among the more up to date advances that individuals have begun embracing to. Acknowledgement of Single phase Liquid Immersion cooling (Sp-LIC) of Information Technology equipment gives proficient cooling frameworks and significant vitality energy savings. This study centers on the unwavering reliability assessment in analyzing the material property of Printed Circuit Board (PCB) and performing Scanning Electron Microscope (SEM) scanning of the samples for any penetration of liquids into PCB. The Accelerated Thermal Cycling (ATC) test in view of ATC JEDEC is relevant just for air cooling. The ASTM benchmark D3455 with some appropriate modification was adopted to test the material compatibility because of constraints with dielectric fluids. For this review, an accelerated thermal degradation of Printed Circuit Board submerged in air, mineral oil and synthetic fluid at a hoisted temperature of 45oC and 35% humidity is proposed for prolonged period of time. Young’s Modulus estimation was done on the Dynamic Mechanical Analyzer (DMA7100) machine. In this thesis, we have looked into the progressions in the physical property of PCB and outwardly investigated the part for any cracks because of Single phase Immersion Cooling. The samples experienced the same stress condition in air and mineral oil during the same time and experiment was performed for the mentioned properties to have a correlation in degradation patterns. The thermal acceleration factors for the degradation might be founded on the design of tests enabling relative interference to be made based on air, mineral oil and synthetic fluid media on parameter corruption. This research determines the material compatibility of PCB with respect to Single phase Immersion Cooling.

Keywords

Immersion cooling, Printed circuit board, Single phase Immersion cooling systems, Reliability of active components, Reliability of Printed circuit board, Young's Modulus of Printed circuit board

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

Comments

Degree granted by The University of Texas at Arlington

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