ORCID Identifier(s)

0000-0002-4540-5672

Graduation Semester and Year

2020

Language

English

Document Type

Thesis

Degree Name

Master of Science in Mechanical Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Dereje Agonafer

Abstract

Oil immersion cooling in high-density data centers is emerging as an alternative for traditional air cooling because of the less power consumption, capacity to handle high power density and less space requirement. To adopt this technique extensively, effect of immersion on reliability of server components in dielectric coolant needs to be evaluated. One of the major reliability concerns in BGA package is 2nd level solder joint failure. The primary reason of solder joint failure is CTE mismatch between the PCB and the package. Also, difference in stiffness of the PCB and the package affects the solder joint reliability. As properties of the PCB change after immersion of PCB in dielectric coolant, it affects the reliability of solder joint. In this thesis, samples of PCBs 185HR/370HR are immersed in dielectric fluid EC100 for the period of 720 hours. The changes in CTE are calculated using Thermo- Mechanical Analyzer (TMA). Solder joint reliability is studied for after and before immersion of PCB in dielectric coolant for BGA package using FE Analysis under thermal cycling.

Keywords

Single phase immersion cooling, CTE, TMA, BGA, Solder joint reliability, FE Analysis

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

Comments

Degree granted by The University of Texas at Arlington

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