UTA Department of Mechanical and Aerospace Faculty Publications preserved and shared openly!

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Submissions from 2020

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Performance Enhancement and Prediction of Composite Materials with Embedded Electrospun Piezoelectric Sensors, Rahman Jani Mazed, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Md Riaz Uddin Ahmed, Rassel Raihan, and Kenneth Reifsnider

Submissions from 2019

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Structural Health Monitoring of Fiber-Reinforced Composite Using Wireless Magnetostrictive Sensors, Sujjatul Islam, Relebohile George Qhobosheane, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Rassel Raihan, Kenneth Reifsnider, and Wen Shen

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Damage Precursor Identification in Composite Laminates using Data Driven Approach, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Rassel Raihan, and Kenneth Reifsnider

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Design of Embedded Wireless Sensors for Real-Time and In-Situ Strain Sensing of Fiber Reinforced Composites, Relebohile George Qhobosheane, Sujjatul Islam, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Rassel Raihan, Kenneth Reifsnider, and Wen Shen

Submissions from 2018

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State Variable Methods of Assessment, Prognosis, and Control of Composite and Bonded Structures, Kenneth Reifsnider, Rassel Raihan, Vamsee Vadlamudi, and Muthu Ram Prabhu Elenchezhian

Submissions from 2017

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Study of Defect Coalescence in Heterogeneous Material Systems using Broad Band Dielectric Spectroscopy., Vamsee Vadlamudi, Muthu Ram Prabhu Elenchezhian, Priyanshu Kumar Banerjee, Rassel Raihan, and Kenneth Reifsnider

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Predicting Adhesive Bond Performance Based on Initial Dielectric Properties, Priyanshu Kumar Banerjee, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Rassel Raihan, and Kenneth Reifsnider

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Self-propulsion of Leidenfrost Drops between Non-Parallel Structures, Cheng Luo, Manjarik Mrinal, and Xiang Wang

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Conditions for Barrel and Clam-Shell Liquid Drops to Move on Bio-inspired Conical Wires, Cheng Luo and Xiang Wang

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Enhanced thermophysical properties via PAO superstructure, Zahra Pournorouz, Amirhossein Mostafavi, Aditya Pinto, Apparao Bokka, Junha Jeon, and Donghyun Shin

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Quality Assessment of Adhesive Bond Based On Dielectric Properties, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Priyanshu Kumar Banerjee, Chaitanya Dave, Anik Mahmood, Rassel Raihan, and Kenneth Reifsnider