Graduation Semester and Year

Spring 2026

Language

English

Document Type

Thesis

Degree Name

Master of Science in Electrical Engineering

Department

Electrical Engineering

First Advisor

Weidong Zhou

Abstract

Photonic Crystal Surface-Emitting Lasers (PCSELs) have emerged as a promising class of semiconductor lasers due to their ability to achieve high-power, single-mode emission with excellent beam quality over large device areas. This thesis presents a comprehensive study on the design, fabrication, and optimization of InP-based PCSELs, with particular focus on key fabrication and integration challenges as well as the current state-of-the-art of InP-based PCSELs.

Another contribution of this research is the investigation of hybrid wafer bonding. Using ComBond technology, electrically conductive bonding between p-type silicon and n-type InP wafers were demonstrated. The bonded interfaces were characterized using Confocal Scanning Acoustic Microscopy (C-SAM), optical microscopy, High-Resolution Transmission Electron Microscopy (HRTEM), and I-V measurements, confirming high-quality, uniform bonding with conductive interfaces. The effect of post-bond thermal annealing was systematically studied, revealing that annealing at high temperature for long periods of time improves electrical performance by reducing the amorphous layer.

In addition, this thesis investigates contact metal optimization on p-InGaAs to improve electrical injection efficiency. Two metal systems, Ti/Au and Ti/Pt/Au, were compared using Circular Transmission Line Method (CTLM) measurements. Results show that Ti/Pt/Au contacts significantly reduce contact resistivity and improve device performance compared to Ti/Au contacts.

Keywords

PCSEL, InP, PhC, Laser, Electrical Wafer Bonding, Contact Metal

Disciplines

Electrical and Electronics | Nanotechnology Fabrication | Optics

License

Creative Commons Attribution 4.0 International License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Available for download on Thursday, May 06, 2027

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