Graduation Semester and Year




Document Type


Degree Name

Doctor of Philosophy in Electrical Engineering


Electrical Engineering

First Advisor

Jonathan W Bredow


This work explores the impedance characteristics of copper wires plated with tin, silver, or nickel, the most common type of wiring used in the computer, communications, and aerospace industries. The background of plated wires and a brief review of related research is provided. This is followed by a detailed development of the theory of plated wires, accompanied by a MAPLE code in the appendix that can be used for the numerical analysis of plated wires having two or more plating layers. The code was used to generate a series of curves predicting the impedance behavior of both solid, "pure" metals, as well as copper wire plated with silver, tin, and nickel. Additional curves are provided highlighting the very interesting impedance behavior of nickel plated copper wire. All of these curves are accompanied by a number of observations to point out the more interesting aspects of the behavior. Several impedance measurements of commonly available military specification plated wire stranded conductors are then discussed. A number of the attempted measurements were unable to resolve the very small impedances. Even so, a last attempt worked very well to demonstrate the predicted impedance behavior, as evidenced by the measured raw data curves shown in contrast to the same curves with fixture parasitics removed. Insertion loss measurements were then made of commonly available military specification plated wire twisted shielded pair that provided further confirming evidence for the predictions made from the numerical analysis. In all cases, observations and comments are provided to explain why some measurements were superior to others, and why certain steps were taken to defeat interference from clouding the results. The document closes with recommendations for future efforts and concluding remarks.


Electrical and Computer Engineering | Engineering


Degree granted by The University of Texas at Arlington