Aditya Pinto

Graduation Semester and Year




Document Type


Degree Name

Master of Science in Mechanical Engineering


Mechanical and Aerospace Engineering

First Advisor

Donghyun Shin


Increasing development in electronic technologies has improved functionality and reduced physical constraints, while managing to impart higher power and performance in smaller and compact devices. As a result of this size reduction, there is also a reduction in the surface area required for heat dissipation. Due to this the thermal management problem has been further intensified. The end result is that the power density continues to rise even with improved thermal management strategies incorporated into the system. Thermal management hence plays an important aspect especially when the design of compact electronic devices is concerned. For most electronic applications thermal loads are a function of time, and hence vary throughout. Thermal loads fluctuate between maximum and minimum load limits. Hence the existing industrial trend used is to size up thermal management components in anticipation of this maximum thermal load, which is not always the case. Increased size and energy consumption from these devices has become a major hurdle to overcome as they severely restrict compactness. To mitigate this problem we studied the emerging technique of utilizing Phase Change Materials (PCMs) for managing temperature in electronics. Due to the intermittent load pattern, PCMs can play a vital role in absorbing the heat from electronic components during maximum operational requirement and release this heat to the ambient when the load requirement drops. For this study we selected a paraffin wax (Octacosane) due to its high heat of fusion and desirable melting point, which fits within the purview of operating temperature of electronics. The melting point is important of a PCM is an important parameter, as it is during this solid-liquid phase transition that the PCM absorbs the maximum amount of heat while maintaining a constant temperature. This study mainly concentrated on improving the thermal conductivity and the thermal storage capacity of the PCM. A nanofluid was synthesized by doping the Octacosane with polyethylene glycol and Silica (SiO2) nanoparticles. An enhancement in specific heat by 7.30% and thermal conductivity by 25.14% was obtained in the nanofluid as compared to the pure Octacosane. These improvements in the thermal properties of the nanofluid will help reduce the size of existing thermal management techniques. And in turn will help to improve the compactness of electronic devices and efficiency of thermal management strategies.


Specific heat, Thermal conductivity, Octacosane, Paraffin wax, Electronic systems, Enhancement


Aerospace Engineering | Engineering | Mechanical Engineering


Degree granted by The University of Texas at Arlington