Effect Of Reflow Variables On The Nanoscale Mechanical Properties Of Lead Free Solders

Author

Tonye Adeogba

Graduation Semester and Year

2009

Language

English

Document Type

Thesis

Degree Name

Master of Science in Materials Science and Engineering

Department

Materials Science and Engineering

First Advisor

Pranesh B Aswath

Abstract

This study presents findings on the nano-mechanical properties of binary and ternary (Cu, Ag) - Sn Solders. Nanoindentation with a cube corner tip was used on Sn-Ag and SAC405 alloy compositions to investigate the effect of reflow process variables on the properties of hardness and reduced modulus on a nanoscale. The specimens tested were sandwich solder joints where Cu was the substrate. While the reflow variables of cooling rate and reflow time were found to cause changes in IMC morphology and solder matrix microstructure, the nano hardness and reduced modulus were independent of these variables. Low max loads coupled with a cube corner indenter tip yielded interesting load-depth curve results on the solder matrix.

Disciplines

Engineering | Materials Science and Engineering

License

This work is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 4.0 International License.

Comments

Degree granted by The University of Texas at Arlington

Recommended Citation

Adeogba, Tonye, "Effect Of Reflow Variables On The Nanoscale Mechanical Properties Of Lead Free Solders" (2009). Material Science and Engineering Theses. 65.
https://mavmatrix.uta.edu/materialscieng_theses/65