Santanu Ghosh

Graduation Semester and Year

2006

Language

English

Document Type

Thesis

Degree Name

Master of Science in Aerospace Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Brian Dennis

Abstract

The process of moisture absorption and subsequent hygroswelling stress development is a cause of concern in the IC packaging industry. Also thermal stresses developed during the lead free reflow process with a high peak temperature (~ 250oC) add to the problem. In Flip Chip packages, the related effects are high shear stresses at the multilayer interfaces and normal stresses in solder balls. This can lead to phenomenon like delamination at the interfaces and UBM opening. In this work we have made an attempt to simulate the moisture absorption process, subsequent hygroswelling stress development, and thermal stress generated during reflow using established FEA techniques. A generic FC package is used as a test vehicle and the analysis is done for two different underfill materials. Also comparison is made with published results for two different test cases.

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

Comments

Degree granted by The University of Texas at Arlington

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