Ojas Tyagi

ORCID Identifier(s)

0000-0001-9068-9953

Graduation Semester and Year

2021

Language

English

Document Type

Thesis

Degree Name

Master of Science in Aerospace Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Dereje Agonafer

Abstract

Fatigue life prediction has become very important factor in reliability of any electronic components to withstand extreme thermal stresses in industrial standard. Hence, photonic packages are widely used in telecommunication and computer applications. The primary focus of this study is to determine the thermal cycles to crack initiation of solder bump used in laser array waferboard for telecommunication applications. This includes GaAs Laser chip on waferboard and Si substrate with pure Indium solder balls in between. Indium has proved higher fatigue life in various experimental studies in the field of reliability and lead-free material. Therefore, a solder ball was designed based on fatigue life formula as well as assembly dimensions were fixed. Here, Darveaux model is used to calculate the same as it proves accurate results. Finite Element Method (FEM) was used in the process with mesh refinement study. Indium proved high fatigue life thus predicting failure by calculation of plastic work and stress-strain relations of the solder joint. These values were verified with calculated results and simulation results predicted close values thus proving the new material a game changer in photonic package and it was concluded that ?-? material proved higher reliability in the field of electronic packaging with an optoelectronic interconnect.

Keywords

FEM, Fatigue

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

Comments

Degree granted by The University of Texas at Arlington

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