ORCID Identifier(s)

0000-0003-2757-5819

Graduation Semester and Year

2015

Language

English

Document Type

Thesis

Degree Name

Master of Science in Mechanical Engineering

Department

Mechanical and Aerospace Engineering

First Advisor

Dereje Agonafer

Abstract

Technological developments have resulted in a growing demand for high power electronic devices. Although these high power devices meet the high performance requirements, they also generate a very large amount of heat which adversely affects their operating efficiency. Most part of the heat within a package is generated at the chip and hence it is imperative to keep junction temperature as low as possible. This is commonly achieved by using heat sinks mounted directly on top of the package. Heat sinks provide a significant enhancement in cooling by increasing the surface area. However, base thickness of heat sinks limits its effectiveness and becomes a bottleneck. This results in hot spots and consequently increases thermal resistance. Using a vapor chamber can reduce thermal resistance by better spreading heat across the heat sink base. This work presents a parametric study of vapor chamber based heat sinks and discusses the merits of using this technology especially in high power devices through CFD modeling.

Keywords

Vapor chamber, Heat spreaders, Electronics cooling

Disciplines

Aerospace Engineering | Engineering | Mechanical Engineering

Comments

Degree granted by The University of Texas at Arlington

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